Cyberoptics Solder Paste Inspection Machine SE300 Ultra

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• Accurate/Repeatable Results
• Field Proven 3D Vision Sensing Technology
• High Resolution 3D sensing technology
• Built-in Fiducial camera & lighting
• Great for Demanding Assemblies
• 3D Height, True Volume & Area measurements for CSPs, 0201s or small pad sizes
• 3D shaded view for examining solder paste deposits
• Registration Measurement
• Bridge Detection for Fine Tune printer setup/monitor process drift
• XML format output
• Adjustable-width, clamping conveyo systems
• CD-RW, Etherne connection, USB ports, RS-232 ports, parallel port and 3.5” disk drive
• Cyberoptics SE300 Ultra Spec Sheet Available Upon Request
 
* Sku #1177: For questions, additional details and pricing please call us or email: sales@empac-global.com